Granted Patent
Utility
US 4,720,396 · App. 06/878,307
Solder finishing integrated circuit package leads
Inventor:
Richard Wood
Patented Case
View Patent ↗
Granted: Jan 19, 1988
Filed: Jun 25, 1986
Inventor
Richard Wood
Assignee (at issue)
FAIRCHILD SEMICONDUCTOR CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.