IP Library › Granted Patent US 4,731,701
Granted Patent Utility
US 4,731,701 · App. 07/049,725

Integrated circuit package with thermal path layers incorporating staggered thermal vias

Inventors: Marco K. Kuo, Nirmal Sharma
Patented Case View Patent ↗
Granted: Mar 15, 1988 Filed: May 12, 1987
Inventors
Marco K. Kuo
Nirmal Sharma
Assignee (at issue)
FAIRCHILD SEMICONDUCTOR CORPORATION

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 4,731,701
App. No.
07/049,725
Filed
1987-05-12
Granted
1988-03-15
Kind
A