Granted Patent
Utility
US 4,734,754 · App. 06/730,181
Semiconductor device having improved structure of multi-wiring layers
Inventor:
Kiyoshi Nikawa
Patented Case
View Patent ↗
Granted: Mar 29, 1988
Filed: May 3, 1985
Inventor
Kiyoshi Nikawa
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.