Granted Patent
Utility
US 4,737,217 · App. 06/866,530
Method of fabricating a substrate for a semiconductor chip package
Inventor:
Herman F. Nied
Patented Case
View Patent ↗
Granted: Apr 12, 1988
Filed: May 23, 1986
Inventor
Herman F. Nied
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.