Granted Patent
Utility
US 4,743,489 · App. 06/927,175
Multilayer wiring substrate
Inventor:
Shinichi Hasegawa
Patented Case
View Patent ↗
Granted: May 10, 1988
Filed: Nov 5, 1986
Inventor
Shinichi Hasegawa
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.