Granted Patent
Utility
US 4,743,570 · App. 07/072,194
Method of thermal treatment of a wafer in an evacuated environment
Inventor:
Lawrence T. Lamont, Jr.
Patented Case
View Patent ↗
Granted: May 10, 1988
Filed: Jul 10, 1987
Inventor
Lawrence T. Lamont, Jr.
Assignee (at issue)
Varian, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.