IP Library › Granted Patent US 4,743,957
Granted Patent Utility
US 4,743,957 · App. 06/858,984

Logic integrated circuit device formed on compound semiconductor substrate

Inventor: Hiromitsu Hirayama
Patented Case View Patent ↗
Granted: May 10, 1988 Filed: May 2, 1986
Inventor
Hiromitsu Hirayama
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 4,743,957
App. No.
06/858,984
Filed
1986-05-02
Granted
1988-05-10
Kind
A