Granted Patent
Utility
US 4,750,666 · App. 06/853,255
Method of fabricating gold bumps on IC's and power chips
Inventors:
Constantine A. Neugebauer, James A. Loughran
Patented Case
View Patent ↗
Granted: Jun 14, 1988
Filed: Apr 17, 1986
Inventors
Constantine A. Neugebauer
James A. Loughran
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.