Granted Patent
Utility
US 4,756,796 · App. 06/917,726
Method of producing wafer
Inventor:
Yuichi Saitou
Patented Case
View Patent ↗
Granted: Jul 12, 1988
Filed: Oct 10, 1986
Inventor
Yuichi Saitou
Assignees (at issue)
Misubishi Kinzoku Kabushiki Kaisha
Japan Silicon Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.