Granted Patent
Utility
US 4,764,484 · App. 07/107,572
Method for fabricating self-aligned, conformal metallization of semiconductor wafer
Inventor:
Roy Mo
Patented Case
View Patent ↗
Granted: Aug 16, 1988
Filed: Oct 8, 1987
Inventor
Roy Mo
Assignee (at issue)
STANDARD MICROSYSTEMS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.