Granted Patent
Utility
US 4,769,744 · App. 06/851,275
Semiconductor chip packages having solder layers of enhanced durability
Inventors:
Constantine A. Neugebauer, Richard O. Carlson
Patented Case
View Patent ↗
Granted: Sep 6, 1988
Filed: Apr 10, 1986
Inventors
Constantine A. Neugebauer
Richard O. Carlson
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.