Granted Patent
Utility
US 4,770,897 · App. 07/046,160
Multilayer interconnection system for multichip high performance semiconductor packaging
Inventor:
Andrew L. Wu
Patented Case
View Patent ↗
Granted: Sep 13, 1988
Filed: May 5, 1987
Inventor
Andrew L. Wu
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.