Granted Patent
Utility
US 4,772,935 · App. 06/875,345
Die bonding process
Inventors:
Harlan Lawler, William S. Phy
Patented Case
View Patent ↗
Granted: Sep 20, 1988
Filed: Jun 17, 1986
Inventors
Harlan Lawler
William S. Phy
Assignee (at issue)
FAIRCHILD SEMICONDUCTOR CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.