IP Library › Granted Patent US 4,774,196
Granted Patent Utility
US 4,774,196 · App. 07/089,184

Method of bonding semiconductor wafers

Inventor: Richard A. Blanchard
Patented Case View Patent ↗
Granted: Sep 27, 1988 Filed: Aug 25, 1987
Inventor
Richard A. Blanchard
Assignee (at issue)
SILICONIX INCORPORATED

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Quick Facts
Patent No.
US 4,774,196
App. No.
07/089,184
Filed
1987-08-25
Granted
1988-09-27
Kind
A