Granted Patent
Utility
US 4,774,635 · App. 06/866,931
Semiconductor package with high density I/O lead connection
Inventors:
Lawrence Greenberg, David Lando
Patented Case
View Patent ↗
Granted: Sep 27, 1988
Filed: May 27, 1986
Inventors
Lawrence Greenberg
David Lando
Assignee (at issue)
American Telephone and Telegraph Company, AT&T Bell Laboratories
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.