Granted Patent
Utility
US 4,791,302 · App. 06/921,183
Semiconductor wafer for providing a plurality of semiconductor chips through electron-beam lithography
Inventor:
Hiroshi Nozue
Patented Case
View Patent ↗
Granted: Dec 13, 1988
Filed: Oct 21, 1986
Inventor
Hiroshi Nozue
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.