Granted Patent
Utility
US 4,814,285 · App. 07/019,697
Method for forming planarized interconnect level using selective deposition and ion implantation
Inventors:
Dyer A. Matlock, Richard L. Lichtel, Jr.
Patented Case
View Patent ↗
Granted: Mar 21, 1989
Filed: Feb 27, 1987
Inventors
Dyer A. Matlock
Richard L. Lichtel, Jr.
Assignee (at issue)
HARRIS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.