Granted Patent
Utility
US 4,827,294 · App. 07/093,924
Thermal ink jet printhead assembly employing beam lead interconnect circuit
Inventor:
Gary Hanson
Patented Case
View Patent ↗
Granted: May 2, 1989
Filed: Oct 26, 1987
Inventor
Gary Hanson
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.