Granted Patent
Utility
US 4,842,662 · App. 07/201,494
Process for bonding integrated circuit components
Inventor:
John W. Jacobi
Patented Case
View Patent ↗
Granted: Jun 27, 1989
Filed: Jun 1, 1988
Inventor
John W. Jacobi
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.