Granted Patent
Utility
US 4,842,699 · App. 07/192,199
Method of selective via-hole and heat sink plating using a metal mask
Inventors:
Chang-Hwang Hua, Ding-Yuan S. Day, Simon S. Chan
Patented Case
View Patent ↗
Granted: Jun 27, 1989
Filed: May 10, 1988
Inventors
Chang-Hwang Hua
Ding-Yuan S. Day
Simon S. Chan
Assignee (at issue)
Avantek, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.