IP Library › Granted Patent US 4,843,695
Granted Patent Utility
US 4,843,695 · App. 07/073,991

Method of assembling tab bonded semiconductor chip package

Inventors: Ralph W. Doe, Stephen P. Hansen, Kenneth M. Brown
Patented Case View Patent ↗
Granted: Jul 4, 1989 Filed: Jul 16, 1987
Inventors
Ralph W. Doe
Stephen P. Hansen
Kenneth M. Brown
Assignee (at issue)
Digital Equipment Corporation

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Quick Facts
Patent No.
US 4,843,695
App. No.
07/073,991
Filed
1987-07-16
Granted
1989-07-04
Kind
A