IP Library Granted Patent US 4,844,945
Granted Patent Utility
US 4,844,945 · App. 07/195,236

Process for producing patterns in dielectric layers formed by plasma enhanced chemical vapor deposition (PECVD)

Inventors: Eldurkar V. Bhaskar, Marzio Leban, Michael D. Angerstein
Patented Case View Patent ↗
Granted: Jul 4, 1989 Filed: May 18, 1988
Inventors
Eldurkar V. Bhaskar
Marzio Leban
Michael D. Angerstein
Assignee (at issue)
Hewlett-Packard Company, L.P.

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Quick Facts
Patent No.
US 4,844,945
App. No.
07/195,236
Filed
1988-05-18
Granted
1989-07-04
Kind
A