Granted Patent
Utility
US 4,847,136 · App. 07/171,047
Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier
Inventor:
Ching P. Lo
Patented Case
View Patent ↗
Granted: Jul 11, 1989
Filed: Mar 21, 1988
Inventor
Ching P. Lo
Assignee (at issue)
Hughes Aircraft Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.