Granted Patent
Utility
US 4,847,146 · App. 07/171,048
Process for fabricating compliant layer board with selectively isolated solder pads
Inventors:
Kwang Jeff Yeh, Manuel B. Valle
Patented Case
View Patent ↗
Granted: Jul 11, 1989
Filed: Mar 21, 1988
Inventors
Kwang Jeff Yeh
Manuel B. Valle
Assignee (at issue)
Hughes Aircraft Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.