Granted Patent
Utility
US 4,847,672 · App. 07/162,049
Integrated circuit die with resistive substrate isolation of multiple circuits
Inventor:
Gary D. Polhemus
Patented Case
View Patent ↗
Granted: Jul 11, 1989
Filed: Feb 29, 1988
Inventor
Gary D. Polhemus
Assignee (at issue)
FAIRCHILD SEMICONDUCTOR CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.