Granted Patent
Utility
US 4,854,986 · App. 07/049,637
Bonding technique to join two or more silicon wafers
Inventor:
Joseph S. Raby
Patented Case
View Patent ↗
Granted: Aug 8, 1989
Filed: May 13, 1987
Inventor
Joseph S. Raby
Assignee (at issue)
HARRIS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.