Granted Patent
Utility
US 4,860,942 · App. 07/126,532
Method for soldering void-free joints
Inventor:
Lawrence K. Takvorian
Patented Case
View Patent ↗
Granted: Aug 29, 1989
Filed: Nov 30, 1987
Inventor
Lawrence K. Takvorian
Assignee (at issue)
Ceradyne, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.