IP Library Granted Patent US 4,865,245
Granted Patent Utility
US 4,865,245 · App. 07/100,683

Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds

Inventors: Eric F. Schulte, Eric Olson
Patented Case View Patent ↗
Granted: Sep 12, 1989 Filed: Sep 24, 1987
Inventors
Eric F. Schulte
Eric Olson
Assignee (at issue)
Santa Barbara Research Center

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Quick Facts
Patent No.
US 4,865,245
App. No.
07/100,683
Filed
1987-09-24
Granted
1989-09-12
Kind
A