Granted Patent
Utility
US 4,865,950 · App. 07/146,632
Laminate for the formation of beam leads for IC chip bonding featuring improved positive-working resist
Inventor:
Thap DoMinh
Patented Case
View Patent ↗
Granted: Sep 12, 1989
Filed: Jan 21, 1988
Inventor
Thap DoMinh
Assignee (at issue)
EASTMAN KODAK COMPANY
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.