Granted Patent
Utility
US 4,873,204 · App. 07/270,415
Method for making silicide interconnection structures for integrated circuit devices
Inventors:
Siu-Weng Simon Wong, Devereaux C. Chen, Kuang-Yi Chiu
Patented Case
View Patent ↗
Granted: Oct 10, 1989
Filed: Nov 8, 1988
Inventors
Siu-Weng Simon Wong
Devereaux C. Chen
Kuang-Yi Chiu
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.