Granted Patent
Utility
US 4,874,477 · App. 07/341,614
Process for preparing the through hole walls of a printed wiring board for electroplating
Inventor:
Phillip Pendleton
Patented Case
View Patent ↗
Granted: Oct 17, 1989
Filed: Apr 21, 1989
Inventor
Phillip Pendleton
Assignee (at issue)
Olin Hunt Specialty Products, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.