Granted Patent
Utility
US 4,885,841 · App. 07/313,221
Vibrational method of aligning the leads of surface-mount electronic components with the mounting pads of printed circuit boards during the molten solder mounting process
Inventor:
John McNabb
Patented Case
View Patent ↗
Granted: Dec 12, 1989
Filed: Feb 21, 1989
Inventor
John McNabb
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.