Granted Patent
Utility
US 4,890,153 · App. 07/848,302
Single bonding shelf, multi-row wire-bond finger layout for integrated circuit package
Inventor:
Ching-An Wu
Patented Case
View Patent ↗
Granted: Dec 26, 1989
Filed: Apr 4, 1986
Inventor
Ching-An Wu
Assignee (at issue)
FAIRCHILD SEMICONDUCTOR CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.