Granted Patent
Utility
US 4,903,437 · App. 07/223,798
Slicing machine for cutting semiconductor material
Inventors:
Yutaka Kubotera, Kazunari Akiyama
Patented Case
View Patent ↗
Granted: Feb 27, 1990
Filed: Jul 25, 1988
Inventors
Yutaka Kubotera
Kazunari Akiyama
Assignee (at issue)
Mitsubishi Kinzoku Kabushiki Kaisha
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.