Granted Patent
Utility
US 4,910,643 · App. 07/203,359
Thick film, multi-layer, ceramic interconnected circuit board
Inventor:
Samuel L. Williams
Patented Case
View Patent ↗
Granted: Mar 20, 1990
Filed: Jun 6, 1988
Inventor
Samuel L. Williams
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.