Granted Patent
Utility
US 4,914,601 · App. 07/160,231
Method for profiling wafers and for locating dies thereon
Inventor:
John B. Smyth, Jr.
Patented Case
View Patent ↗
Granted: Apr 3, 1990
Filed: Feb 25, 1988
Inventor
John B. Smyth, Jr.
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.