IP Library Granted Patent US 4,914,741
Granted Patent Utility
US 4,914,741 · App. 07/059,051

Tape automated bonding semiconductor package

Inventors: Kenneth M. Brown, Robert J. Hannemann, Stephen P. Hansen
Patented Case View Patent ↗
Granted: Apr 3, 1990 Filed: Jun 8, 1987
Inventors
Kenneth M. Brown
Robert J. Hannemann
Stephen P. Hansen
Assignee (at issue)
Digital Equipment Corporation

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Quick Facts
Patent No.
US 4,914,741
App. No.
07/059,051
Filed
1987-06-08
Granted
1990-04-03
Kind
A