Granted Patent
Utility
US 4,918,385 · App. 07/307,727
Method and process for testing the reliability of integrated circuit (IC) chips and novel IC circuitry for accomplishing same
Inventor:
Robert W. Shreeve
Patented Case
View Patent ↗
Granted: Apr 17, 1990
Filed: Feb 7, 1989
Inventor
Robert W. Shreeve
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.