Granted Patent
Utility
US 4,925,524 · App. 07/293,550
Method for forming tungsten structures in a semiconductor
Inventor:
Christopher Beatty
Patented Case
View Patent ↗
Granted: May 15, 1990
Filed: Jan 4, 1989
Inventor
Christopher Beatty
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.