Granted Patent
Utility
US 4,926,022 · App. 07/368,598
Laser reflow soldering process and bonded assembly formed thereby
Inventor:
Gary M. Freedman
Patented Case
View Patent ↗
Granted: May 15, 1990
Filed: Jun 20, 1989
Inventor
Gary M. Freedman
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.