Granted Patent
Utility
US 4,939,101 · App. 07/240,332
Method of making direct bonded wafers having a void free interface
Inventors:
Robert D. Black, Stephen Daley Arthur, Robert S. Gilmore, Homer H. Glascock, II
Patented Case
View Patent ↗
Granted: Jul 3, 1990
Filed: Sep 6, 1988
Inventors
Robert D. Black
Stephen Daley Arthur
Robert S. Gilmore
Homer H. Glascock, II
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.