IP Library › Granted Patent US 4,940,413
Granted Patent Utility
US 4,940,413 · App. 07/385,615

Electrical make/break interconnect having high trace density

Inventors: Winthrop D. Childers, William John Sperry, Jr.
Patented Case View Patent ↗
Granted: Jul 10, 1990 Filed: Jul 26, 1989
Inventors
Winthrop D. Childers
William John Sperry, Jr.
Assignee (at issue)
Hewlett-Packard Company, L.P.

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Quick Facts
Patent No.
US 4,940,413
App. No.
07/385,615
Filed
1989-07-26
Granted
1990-07-10
Kind
A