Granted Patent
Utility
US 4,940,508 · App. 07/371,211
Apparatus and method for forming die sites in a high density electrical interconnecting structure
Inventors:
Shamouil Shamouilian, Paul N. Ludwig
Patented Case
View Patent ↗
Granted: Jul 10, 1990
Filed: Jun 26, 1989
Inventors
Shamouil Shamouilian
Paul N. Ludwig
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.