Granted Patent
Utility
US 4,946,376 · App. 07/333,938
Backside metallization scheme for semiconductor devices
Inventors:
Ravinder K. Sharma, William H. Lytle, Angela Rogona, Bennett L. Hileman
Patented Case
View Patent ↗
Granted: Aug 7, 1990
Filed: Apr 6, 1989
Inventors
Ravinder K. Sharma
William H. Lytle
Angela Rogona
Bennett L. Hileman
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.