Granted Patent
Utility
US 4,948,756 · App. 07/265,355
Method of making interconnects between polysilicon layers
Inventor:
Seiji Ueda
Patented Case
View Patent ↗
Granted: Aug 14, 1990
Filed: Oct 28, 1988
Inventor
Seiji Ueda
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.