Granted Patent
Utility
US 4,949,034 · App. 07/322,390
Method for contactless evaluation of characteristics of semiconductor wafers and devices
Inventors:
Makoto Imura, Akira Usami
Patented Case
View Patent ↗
Granted: Aug 14, 1990
Filed: Mar 13, 1989
Inventors
Makoto Imura
Akira Usami
Assignees (at issue)
Mitsubishi Kinzoku Kabushiki Kaisha
Japan Silicon Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.