IP Library › Granted Patent US 4,953,287
Granted Patent Utility
US 4,953,287 · App. 07/068,874

Thermal-bonding process and apparatus

Inventors: William J. West, Howard H. Taub, Robert J. Miller
Patented Case View Patent ↗
Granted: Sep 4, 1990 Filed: Jul 1, 1987
Inventors
William J. West
Howard H. Taub
Robert J. Miller
Assignee (at issue)
Hewlett-Packard Company, L.P.

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Quick Facts
Patent No.
US 4,953,287
App. No.
07/068,874
Filed
1987-07-01
Granted
1990-09-04
Kind
A