Granted Patent
Utility
US 4,954,878 · App. 07/373,960
Method of packaging and powering integrated circuit chips and the chip assembly formed thereby
Inventors:
Leslie R. Fox, Paul Wade, William L. Schmidt
Patented Case
View Patent ↗
Granted: Sep 4, 1990
Filed: Jun 29, 1989
Inventors
Leslie R. Fox
Paul Wade
William L. Schmidt
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.