Granted Patent
Utility
US 4,959,751 · App. 07/297,212
Ceramic hybrid integrated circuit having surface mount device solder stress reduction
Inventors:
John A. Hearn, Dwight L. Schwarz, Dwadasi H. R. Sarma, Ponnusamy Palanisamy
Patented Case
View Patent ↗
Granted: Sep 25, 1990
Filed: Jan 17, 1989
Inventors
John A. Hearn
Dwight L. Schwarz
Dwadasi H. R. Sarma
Ponnusamy Palanisamy
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.