IP Library Granted Patent US 4,962,004
Granted Patent Utility
US 4,962,004 · App. 07/406,647

Method of inhibiting electrochemical reduction of polyimide during electroplating and articles formed thereby

Inventor: Jieh-Hwa Shyu
Patented Case View Patent ↗
Granted: Oct 9, 1990 Filed: Sep 13, 1989
Inventor
Jieh-Hwa Shyu
Assignee (at issue)
Digital Equipment Corporation

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Quick Facts
Patent No.
US 4,962,004
App. No.
07/406,647
Filed
1989-09-13
Granted
1990-10-09
Kind
A